Reliable Data You Can Trust
Reliable Data You Can Trust
A recent report published by Infinium Global Research on ESD foam packaging market provides in-depth analysis of segments and sub-segments in global as well as regional ESD foam packaging market. The study also highlights the impact of drivers, restraints and macro indicators on the global and regional ESD foam packaging market over the short term as well as long term. The report is a comprehensive presentation of trends, forecast and dollar values of global ESD foam packaging market. According to the report the global ESD foam packaging market is projected to grow at a CAGR of 6.5% over the forecast period of 2018-2024.
Segment Covered
The report on global ESD foam packaging market covers segments such as application, material and additive and end-use industry. On the basis of application, the global ESD foam packaging market is categorized into an electrical and electronic component. On the basis of material and additive, the global ESD foam packaging market is categorized into conductive polymer and dissipative polymer. On the basis of end-use industry, the global ESD foam packaging market is categorized into the automobile, defense and military, manufacturing, electrical and electronics and aerospace.
Geographic Coverage
The countries covered in the North America region include the U.S., Canada, and Mexico; while Asia-Pacific includes China, Japan, India, South Korea, Malaysia, and among others. Moreover, Germany, U.K., France, Spain, and Rest of Europe are included in the European region. The U.S. drives the growth in the North America region as it is the largest market in the region. The Asia-pacific region offers substantial potential for the market growth owing to rapid growth in markets such as India and China. The APAC region is projected to experience growth at a CAGR of x.x% over the period of 2018-2024.
Companies Profiled:
The report provides profiles of the companies in the global ESD foam packaging market such as, Electrotek Static Controls Pvt. Ltd., Statclean Technology (S) Pte Ltd., Elcom U.K. Ltd., Helios Packaging, Botron Company, Inc., GWP Group Limited, Conductive Containers, Inc., Nefab AB, Tekins Limited and Others.
Report Highlights:
The report provides deep insights into demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the global ESD foam packaging market. Moreover, IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of ESD foam packaging market. Moreover, the study highlights current market trends and provides forecast from 2018-2024. We also have highlighted future trends in the ESD foam packaging market that will impact the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players. This report will help manufacturers, suppliers, and distributors of the ESD foam packaging market to understand the present and future trends in this market and formulate their strategies accordingly.
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