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Electronic Thermal Management Material Market (Product - Conductive Pastes, Conductive Tapes, Phase Change Materials, Gap Fillers, and Thermal Greases; End User - Consumer Electronics, Automotive, Aerospace, Healthcare, and Telecommunication): Global Industry Analysis, Trends, Size, Share and Forecasts to 2025

Electronic Thermal Management Material Market (Product - Conductive Pastes, Conductive Tapes, Phase Change Materials, Gap Fillers, and Thermal Greases; End User - Consumer Electronics, Automotive, Aerospace, Healthcare, and Telecommunication): Global Industry Analysis, Trends, Size, Share and Forecasts to 2025

Report Code: ICT1342 Category: Electronics, ICT and Semiconductors Published: February, 2020

A recent report published by Infinium Global Research on electronic thermal management material market provides in-depth analysis of segments and sub-segments in the global as well as regional electronic thermal management material market. The study also highlights the impact of drivers, restraints, and macro indicators on the global and regional electronic thermal management material market over the short term as well as long term. The report is a comprehensive presentation of trends, forecast and dollar values of global electronic thermal management material market. According to the report, the global electronic thermal management material market is projected to grow at a CAGR of 9% over the forecast period of 2019-2025.


Global Electronic Thermal Management Material Market

 

Segment Covered

The report on global electronic thermal management material market covers segments such as product, and end user. On the basis of product, the sub-markets include conductive pastes, conductive tapes, phase change materials, gap fillers, and thermal greases. On the basis of end user, the sub-markets include consumer electronics, automotive, aerospace, healthcare, and telecommunication.

 

Companies Profiled:

The report provides profiles of the companies in the market such as Boyd Corporation, Laird PLC, Henkel AG & Company, Honeywell International Inc., Lord Corporation, European Thermodynamics Ltd, Parker Hannifin Corporation, AI Technology, Inc., The 3M Company, and DuPont de Nemours, Inc.

 

Report Highlights:

The report provides deep insights into the demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of electronic thermal management material market. Moreover, the study highlights current market trends and provides forecast from 2019-2025. We also have highlighted future trends in the market that will affect the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players.


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