Semiconductor Fabless Market (Type - Microcontrollers (MCUs), Digital Signal Processors (DSPs), Graphic Processing Units (GPUs), Application Specific Integrated Circuits (ASIC), Power Management ICs (PMICs), and Others; End-use - Consumer Electronics, Automotive, Industrial, Telecommunication, Healthcare, and Others): Global Industry Analysis, Trends, Size, Share and Forecasts to 2032

Semiconductor Fabless Market (Type - Microcontrollers (MCUs), Digital Signal Processors (DSPs), Graphic Processing Units (GPUs), Application Specific Integrated Circuits (ASIC), Power Management ICs (PMICs), and Others; End-use - Consumer Electronics, Automotive, Industrial, Telecommunication, Healthcare, and Others): Global Industry Analysis, Trends, Size, Share and Forecasts to 2032

Report Code: IGR01844 Category: Electronics, ICT & Semiconductors Published: September, 2025

A recent report published by Infinium Global Research on semiconductor fabless market provides in-depth analysis of segments and sub-segments in the global as well as regional semiconductor fabless market. The study also highlights the impact of drivers, restraints, and macro indicators on the global and regional semiconductor fabless market over the short term as well as long term. The report is a comprehensive presentation of trends, forecast and dollar values of global semiconductor fabless market.

Market Insight:

The global semiconductor fabless market was valued at USD 3.50 billion in 2023 and is expected to reach USD 8.18 billion in 2032, with a CAGR of 9.92% during the forecast period 2024-2032.

The semiconductor fabless market is experiencing growth driven by technological advancements and supply chain changes. Automotive-grade chip design is also gaining traction, as EVs and ADAS systems require high-reliability, low-power ICs. Regional design hub diversification is happening, particularly in China, India, and Southeast Asia, as countries seek semiconductor self-reliance and design sovereignty. Advanced node design and chiplet architectures are also gaining traction, with fabless players investing in modular designs to optimize performance, yield, and cost. The semiconductor fabless market faces challenges such as increasing design complexity, geopolitical tensions, rising development costs, and supply chain dependencies on advanced foundries such as Taiwan Semiconductor Manufacturing Company Limited, and SAMSUNG. Designing chips at advanced nodes requires significant R&D investments and access to EDA tools, creating barriers for smaller players. Export restrictions and trade conflicts complicate access to critical IP and manufacturing partnerships. To address these issues, fabless companies are adopting chiplet-based modular architectures, partnering with foundries through long-term agreements, investing in in-house IP development, and diversifying geographically.

The semiconductor fabless market is growing due to the increasing demand for artificial intelligence (AI) and high-performance computing (HPC). With the widespread adoption of AI technologies across various industries, there is a need for application-specific integrated circuits (ASICs), GPUs, and AI accelerators that can deliver massive computational power with high energy efficiency. Traditional general-purpose processors are often inadequate for the parallel processing and data-intensive workloads demanded by modern artificial intelligence (AI) and machine learning (ML) applications. This has led to a shift where fabless companies focus on designing customized, high-performance chips optimized for specific AI tasks. The rapid expansion of data centers and hyperscale computing platforms by tech giants such as Google, Amazon.com, Inc., and Microsoft is pushing fabless firms to develop advanced processor architectures and chiplet-based designs. This allows fabless firms to quickly iterate designs and tailor solutions for diverse AI workloads, providing agility and a competitive edge in a fast-evolving market. The convergence of AI, HPC, and edge computing continues to be a transformative force, positioning fabless semiconductor companies at the forefront of next-generation technology development.

Additionally, the semiconductor fabless market is growing due to the increasing demand for compact, energy-efficient, and integrated system-on-chip solutions for consumer electronics and IoT devices. Fabless companies excel in high-speed connectivity, real-time data processing, low power consumption, and multifunctional capabilities. The rise of smart living and connected ecosystems is driving the deployment of billions of IoT endpoints, requiring various semiconductors. Fabless firms can innovate, customize chip designs, and adapt to fast-evolving technology trends. The convergence of technologies such as Bluetooth Low Energy and UWB is increasing design complexity, making the fabless model a strategic enabler in delivering customized semiconductor solutions. However, the semiconductor fabless market's growth is hindered by the increasing complexity and cost of chip design. Advanced nodes offer better performance but require intricate design architectures, tighter tolerances, and advanced layout techniques. Transitioning to FinFET and GAA transistor structures requires new methodologies, simulation capabilities, and expensive electronic design automation tools. Additionally, the shortage of skilled design engineers and the high cost of tape-out further strain the industry. Nonetheless, the growth in automotive electronics, especially in electric vehicles, autonomous driving, and advanced driver-assistance systems, is offering significant growth opportunities for the market. This shift has increased demand for custom-designed, automotive-grade integrated circuits that can operate reliably under extreme conditions. Fabless companies can focus on designing specialized chips without owning fabrication plants, enhancing vehicle safety and performance. The rise of autonomous and connected vehicles also demands edge AI processing. Governments worldwide are supporting EV adoption through subsidies and infrastructure development, creating a multi-billion-dollar opportunity for fabless semiconductor companies to deliver tailored, high-reliability chip solutions.

The global semiconductor fabless market is geographically segmented into North America, Europe, Asia Pacific, and the Rest of the World. Among the regions, the Asia-Pacific region is expected to dominate the semiconductor fabless market in the forecasted period due to the growth of domestic chip design companies, strong government support, and increasing demand from key sectors such as consumer electronics, automotive, and telecommunications. Countries such as China, Taiwan, South Korea, and India are investing in developing self-reliant semiconductor ecosystems, focusing on expanding local IC design capabilities to reduce dependency on foreign technologies. Taiwan already has established fabless firms such as PAO NOVATEK and Realtek Semiconductor Corp. The region's proximity to top foundries facilitates efficient collaboration and faster time-to-market. Moreover, North America is anticipated to witness significant growth during the forecasted period in the global semiconductor fabless market, with major industry leaders such as Broadcom Inc. and NVIDIA Corporation. The region's mature semiconductor ecosystem, strong R&D investment, and collaboration with global foundries contribute to growth. North America also excels in advanced chip design tools, IP cores, and AI applications. Government support through initiatives such as CHIPS and the Science Act strengthens domestic design and innovation capabilities, stimulates the region's growth in the fabless semiconductor industry.

Report Scope of the Semiconductor Fabless Market:

Report Coverage Details
Market Size in 2023 USD 3.50 Billion
Market Size by 2032 USD 8.18 Billion
Growth Rate from 2024 to 2032 CAGR of 9.92%
Largest Market Asia Pacific
No. of Pages 180
Market Drivers
  • The growth of the semiconductor fabless market is driven by increasing demand for AI and high-performance computing.

  • The semiconductor fabless market is experiencing significant growth due to the rapid development of consumer electronics and IoT devices.

Market Segmentation By Type, and By End-use
Regional Scope North America, Europe, Asia Pacific, and RoW

Segment wise revenue contribution in the global semiconductor fabless market

The report on global semiconductor fabless market provides a detailed analysis of segments in the market based on Type, and End-use.

Segmentation Based on Type

·       Microcontrollers (MCUs)

·       Digital Signal Processors (DSPs)

·       Graphic Processing Units (GPUs)

·       Application Specific Integrated Circuits (ASIC)

·       Power Management ICs (PMICs)

·       Others

Segmentation Based on End-use

·       Consumer Electronics

·       Automotive

·       Industrial

·       Telecommunication

·       Healthcare

·       Others

Company Profiled:

·       Broadcom Inc.

·       Qualcomm Technologies, Inc.

·       NVIDIA Corporation

·       Advanced Micro Devices, Inc.

·       MediaTek Inc.

·       Novatek Microelectronics Corp

·       UNISOC(Shanghai)Technologies Co., Ltd.

·       XMOS

·       LSI Computer Systems, Inc.

·       Realtek Semiconductor Corp.

Report Highlights:

The report provides deep insights into demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of the semiconductor fabless market. Moreover, the study highlights current market trends and provides forecasts from 2024-2032. We also have highlighted future trends in the market that will affect the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players.

Frequently Asked Questions (FAQ's)

The global semiconductor fabless market was valued at USD 3.50 Billion in 2023.
It is likely to grow at a CAGR of 9.92% during the forecast period 2024-2032.
The global semiconductor fabless market is estimated to reach USD 8.18 Billion by the end of 2032.
Asia Pacific is anticipated to exhibit high demand for semiconductor fabless market during the forecast period.
Broadcom Inc., Qualcomm Technologies, Inc., NVIDIA Corporation, Advanced Micro Devices, Inc., MediaTek Inc., Novatek Microelectronics Corp, UNISOC(Shanghai)Technologies Co., Ltd., XMOS, LSI Computer Systems, Inc., and Realtek Semiconductor Corp..
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