1. Report Overview
1.1. Report Description
1.2. Research Methods
1.3. Research Approaches
2. Executive Summary
3. Market Overview
3.1. Introduction
3.2. Market Dynamics
3.2.1. Drivers
3.2.2. Restraints
3.2.3. Opportunities
3.2.4. Challenges
3.3. PEST-Analysis
3.4. Porter's Diamond Model for Japan Semiconductor Metrology and Inspection Equipment Market
3.5. IGR-Growth Matrix Analysis
3.6. Value Chain Analysis of Japan Semiconductor Metrology and Inspection Equipment Market
3.7. Competitive Landscape in Japan Semiconductor Metrology and Inspection Equipment Market
4. Japan Semiconductor Metrology and Inspection Equipment Market by Technology
4.1. Inspection Equipment
4.1.1.  Wafer Inspection
4.1.2.  Defect Inspection
4.1.3.  Mask / Photomask Inspection
4.1.4.  Bump & Package Inspection
4.1.5.  Others
4.2. Metrology Equipment
4.2.1.  Critical Dimension (CD) Metrology
4.2.2.  Thin Film Metrology
4.2.3.  Overlay Metrology
4.2.4.  Wafer Shape & Surface Metrology
4.2.5.  Others
5. Japan Semiconductor Metrology and Inspection Equipment Market by Dimension
5.1. 2D Metrology / Inspection
5.2. 3D Metrology / Inspection
5.3. Hybrid 2D/3D Systems
6. Japan Semiconductor Metrology and Inspection Equipment Market by Process Node
6.1. ≤ 7 nm
6.2. 8-14 nm
6.3. 15-28 nm
6.4. 28 nm
7. Japan Semiconductor Metrology and Inspection Equipment Market by Fab Type
7.1. Foundry
7.2. Memory
7.3. Logic
7.4. Integrated Device Manufacturer (IDM)
8. Company Profiles
8.1. Company 1
8.2. Company 2
8.3. Company 3
8.4. Company 4
8.5. Company 5
1. Report Overview
1.1. Report Description
1.2. Research Methods
1.3. Research Approaches
2. Executive Summary
3. Market Overview
3.1. Introduction
3.2. Market Dynamics
3.2.1. Drivers
3.2.2. Restraints
3.2.3. Opportunities
3.2.4. Challenges
3.3. PEST-Analysis
3.4. Porter's Diamond Model for Japan Semiconductor Metrology and Inspection Equipment Market
3.5. IGR-Growth Matrix Analysis
3.6. Value Chain Analysis of Japan Semiconductor Metrology and Inspection Equipment Market
3.7. Competitive Landscape in Japan Semiconductor Metrology and Inspection Equipment Market
4. Japan Semiconductor Metrology and Inspection Equipment Market by Technology
4.1. Inspection Equipment
4.1.1.  Wafer Inspection
4.1.2.  Defect Inspection
4.1.3.  Mask / Photomask Inspection
4.1.4.  Bump & Package Inspection
4.1.5.  Others
4.2. Metrology Equipment
4.2.1.  Critical Dimension (CD) Metrology
4.2.2.  Thin Film Metrology
4.2.3.  Overlay Metrology
4.2.4.  Wafer Shape & Surface Metrology
4.2.5.  Others
5. Japan Semiconductor Metrology and Inspection Equipment Market by Dimension
5.1. 2D Metrology / Inspection
5.2. 3D Metrology / Inspection
5.3. Hybrid 2D/3D Systems
6. Japan Semiconductor Metrology and Inspection Equipment Market by Process Node
6.1. ≤ 7 nm
6.2. 8-14 nm
6.3. 15-28 nm
6.4. 28 nm
7. Japan Semiconductor Metrology and Inspection Equipment Market by Fab Type
7.1. Foundry
7.2. Memory
7.3. Logic
7.4. Integrated Device Manufacturer (IDM)
8. Company Profiles
8.1. Company 1
8.2. Company 2
8.3. Company 3
8.4. Company 4
8.5. Company 5