A recent report published by Infinium Global Research on fan-out wafer level packaging market provides in-depth analysis of segments and sub-segments in the global as well as regional fan-out wafer level packaging market. The study also highlights the impact of drivers, restraints, and macro indicators on the global and regional fan-out wafer level packaging market over the short term as well as long term. The report is a comprehensive presentation of trends, forecast and dollar values of global fan-out wafer level packaging market. According to the report, the global fan-out wafer level packaging market is projected to grow at a healthy CAGR over the forecast period of 2019-2025.
Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. FOWLP technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades. Innovations in semiconductor technologies have enabled the incorporation of several functions on a smaller footprint. Miniaturized semiconductor components such as wireless modules, RF components, and application processors can be easily integrated with smartphones, automobiles, and healthcare equipment. This has resulted in an increasing demand for miniaturized electronic components.
Increasing demand for compactly designed electronics across the globe is the major driving factor for the FOWLP market. Furthermore, factors such as developments in wireless communication technologies, integration of Human-Machine Interface (HMI) technologies, and development of telecommunication standards are other driving factors for the market growth. FOWLP packaging technology also reduces the packaging and testing costs by allowing the fabrication and testing at the wafer level. This technology is appropriate for applications that require high power and extreme miniaturization. However, the high cost of the overall packaging and manufacturing restrains the market growth. Moreover, increasing demand for compactly designed electronics expected to provide growth opportunities to the market players.
Geographically, Asia-Pacific is the largest market for the global FOWLP market owing to increasing disposable income in countries such as China and India. The demand for wafer level packaging is rising owing to the growing adoption of smartphones in India. Europe is the second-largest market for FOWLP. FOWLP is in volume manufacturing for a couple of years and services are offered in Asia as well as in Europe.
The report on global fan-out wafer level packaging market covers segments such as technology. On the basis of technology, the sub-markets include high-density FOWLP, and standard density FOWLP.
The report provides profiles of the companies in the market such as Infineon Technologies AG, Amkor Technology, ASE Technology Holding, SAMSUNG ELECTRO-MECHANICS, STATS ChipPAC, Deca Technologies, Inc., Taiwan Semiconductor Manufacturing Company, Nanium S.A, ADL Engineering Ltd, Fujikura Ltd., and other companies.
The report provides deep insights into the demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of fan-out wafer level packaging market. Moreover, the study highlights current market trends and provides forecast from 2019-2025. We also have highlighted future trends in the market that will affect the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players.