A recent report published by Infinium Global Research on 3D TSV market provides in-depth analysis of segments and sub-segments in the global as well as regional 3D TSV market. The study also highlights the impact of drivers, restraints, and macro indicators on the global and regional 3D TSV market over the short term as well as long term. The report is a comprehensive presentation of trends, forecast and dollar values of global 3D TSV market. According to the report, the global 3D TSV market is projected to grow at a CAGR of 46.5% over the forecast period of 2018-2024.
3D through-silicon via (TSV) is a high performance interconnect technique that passes through a silicon wafer by a vertical electrical connection. TSV technique is an alternative to wire-bond and flip chips owing to the length of the connections in TSVs are shorter than the traditional technique. Further, advantages of TSVs are lower power consumption, better electrical performance, higher density with wider data width and bandwidth. Through-silicon via (TSV) interconnects have applications in 2.5D TSV and 3D TSV packaging that require very high performance and functionality at the lowest energy. Through-silicon via used in image sensors such as CMOS image sensors and 3D integrated circuits. In 3D integrated circuits, TSV provides shortest chip-to-chip interconnection, smallest pad size, and pitch of interconnects.
Rising demand for miniaturization of electronic device owing to its improved compact size chip architecture drives the growth of 3D TSV market. Further high performance, high density, and power utilization of 3D TSV help in the process of miniaturization of electronic device that fuels the growth 3D TSV market. Moreover, an increase in the adoption of cloud-based storage for packaging applications fuels the growth of 3D TSV market. In cloud-based storage applications, 3D TSV majorly used owing to its ability to transmit high-speed data with lower power consumption. Furthermore, use of 3D TSV in Dynamic random-access memory (DRAM) that stores each bit of data in a separate tiny capacitor within an integrated circuit propels the growth of 3D TSV market. Development in the smart lighting sectors that are designed for energy efficiency coupled with the growth of 3D TSV market. However, a possibility of fragility while handling the ultra-thin components and thermal issues regarding components hinders the growth of 3D TSV market. On the other hand, thermal issues caused due to a high level of incorporation is a challenging factor for the growth of the 3D TSV market. Technological advancement and applications related to MEMS, memory, imaging, and optoelectronics are expected to provide beneficial opportunities for 3D TSV market.
Among the geographies, Asia Pacific dominated the 3D TSV market. In this region, demand for a 3D integrated circuit using TSV technology has resulted in the adoption of 3D TSV technology. Increasing demand for new memory technology and huge presence of market players in Asia Pacific region fuels the growth of 3D TSV market. Intensifying research and development activities regarding the design of 3D integrated circuits in North America and Europe region boosts the growth of 3D TSV market in the region. The growth in the European region is owing to the high and improved electronics products having the small form factor and reduced power consumption along with low cost. Advancement in the semiconductor industries has led the Latin America and African regions to grow at a favorable pace.
The report on global 3D TSV market covers segments such as product and end-user. On the basis of product, the sub-markets include mems, imaging and optoelectronics, memory, advanced led packaging, CMOS image sensors, and others. On the basis of end-user, the sub-markets include automotive, consumer electronics, information technology & telecommunication, aerospace and defense, and others.
The report provides regional analysis covering geographies such as North America, Europe, Asia-Pacific, and Rest of the World. In this section, the key trends and market size for each geography are provided over the period of 2016-2024. The countries covered in the North America region include the U.S., Canada, and Mexico; while Asia-Pacific includes China, Japan, India, South Korea, Malaysia, and among others. Moreover, Germany, U.K., France, Spain, and Rest of Europe are included in the European region. The U.S. drives the growth in the North America region as it is the largest market in this region. The Asia-pacific region offers a substantial potential for the market growth owing to rapid growth in markets such as India and China.
The report provides profiles of the companies in the market such as Intel Corporation, Amkor Technology, Broadcom Ltd, Samsung Electronics Co Ltd, ASE Technology Holding Co., Ltd., TOSHIBA CORPORATION, Taiwan Semiconductor Manufacturing Company Limited, United Microelectronics Corporation, TEZZARON, and Xilinx Inc.
The report provides deep insights into the demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of 3D TSV market. Moreover, the study highlights current market trends and provides forecast from 2018-2024. We also have highlighted future trends in the market that will affect the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players.
Get free analyst support for the queries before and post purchasing report.
Be assured of 100% customer satisfaction about the research and get 24X7 customer support.
Infinium has achieved over 400%+ growth in its repository and revenue over the last 2 years. Yes, we are proud to say we are growing at a great pace and becoming a trusted partner among our clients.
sign up for our newsletter