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3D IC and 2.5D IC Packaging Market (Technology - 3D Wafer-Level Chip-Scale Packaging (WLCSP), 3D TSV, 2.5D, and Others; End-User - Consumer Electronics, Automotive, Military & Aerospace, Medical Devices, Telecommunication, Smart Technologies, Industrial Sector, and Others; Application - MEMS/Sensors, Power, Analog and Mixed Signal, RF, Memory, LED, Photonics, RF): Global Industry Analysis, Trends, Size, Share and Forecasts to 2024

  • Published : December, 2018

  • Rep Id : ICT0223

  • Category : Electronics, ICT and Semiconductors

  • Status : Published

This report provides exclusive insights into the COVID-19 impact on the 3D IC and 2.5D IC Packaging Market. The detailed analysis provides information about the impact of the outbreak on the demand and supply conditions, trends and forecasts of the 3D IC and 2.5D IC Packaging Market. Moreover, the impact analysis covers the study of the COVID-19 on the supply chain of 3D IC and 2.5D IC Packaging Market. The sectoral impact shall provide insights into both short term and long term effects of the pandemic on the related and support industries.

A recent report published by Infinium Global Research on 3D IC and 2.5D IC packaging market provides an in-depth analysis of segments and sub-segments in the global as well as regional 3D IC and 2.5D IC packaging market. The study also highlights the impact of drivers, restraints, and macro indicators on the global and regional 3D IC and 2.5D IC packaging market over the short term as well as long term. The report is a comprehensive presentation of trends, forecast and dollar values of global 3D IC and 2.5D IC packaging market. According to the report, the global 3D IC and 2.5D IC packaging market are projected to grow at a CAGR of 36% over the forecast period of 2018-2024.


Market Insight

The three-dimensional integrated circuit (3D IC) is an integrated circuit that is manufactured by assembling multiple layers of silicon wafers or dies while 2.5-dimensional integrated circuit (2.5D IC) is a packaging technology with active electronic components. 3D IC and 2.5D IC packaging used to improve performance and the reduction of timing delays. Using vertical interconnections and through-silicon vias (TSVs), they act as a singles device. Increased bandwidth, power efficiency, and lower latency are the advantages of 3D IC and 2.5D IC packaging technology. Applications of 3D IC and 2.5D IC packaging are in artificial intelligence, high-performance computing, data Centers, and high-performance network applications.

 

Growing demand for smartphones, tablets, and gaming devices drives the growth of 3D IC and 2.5D IC packaging market. High usage of data centers as well as cloud computing results in rising demand for high-end computing, servers, and data centers. Furthermore, miniaturization of electronic devices is advancing rapidly owing to the comparative ease in miniaturizing electrons that boosts the growth of 3D IC and 2.5D IC packaging market. Moreover, higher availability of logic based packaging drives the growth of 3D IC and 2.5D IC packaging market. However, the high cost of 3D IC & 2.5D IC packages hinders the growth of 3D IC and 2.5D IC packaging market. In addition, thermal issues related to a higher level of integration hampers the growth of 3D IC and 2.5D IC packaging market. Technological developments in 3D IC & 2.5D IC packaging are expected to provide beneficial opportunities for the 3D IC and 2.5D IC packaging market.

 

Among the geographies, Asia-pacific dominates the 3D IC and 2.5D IC packaging market owing to various applications in consumer electronics. The presence of manufactures and suppliers along with the integration of 3D IC and 2.5D IC packaging technology in the Asia Pacific region is growing rapidly that boosts the growth of 3D IC and 2.5D IC packaging market .The rapid adoption and evolving use of smartphones along with tablets and e-readers in the U.S. fuels the growth of 3D IC and 2.5D IC packaging market.

 

Segment Covered

The report on global 3D IC and 2.5D IC packaging market covers segments such as technology, end-user, and application. On the basis of technology, the sub-markets include 3D wafer-level chip-scale packaging (WLCSP), 3D TSV, 2.5 D, and others. On the basis of end-user, the sub-markets include consumer electronics, automotive, military & aerospace, medical devices, telecommunication, smart technologies, industrial sector, and others. On the basis of application, the sub-markets include MEMS/sensors, power, analog, and mixed-signal, RF, and photonics, imaging & optoelectronics, logic, memory, LED, photonics, RF, and others.

 

Geographic Coverage

The report provides regional analysis covering geographies such as North America, Europe, Asia-Pacific, and Rest of the World. In this section, the key trends and market size for each geography are provided over the period of 2016-2024. The countries covered in the North America region include the U.S., Canada, and Mexico while Asia-Pacific includes China, Japan, India, South Korea, Malaysia, and among others. Moreover, Germany, U.K., France, Spain, and Rest of Europe are included in the European region. The U.S. drives the growth in the North America region as it is the largest market in this region. The Asia-pacific region offers a substantial potential for the market growth owing to rapid growth in markets such as India and China.


3D IC and 2.5D IC Packaging Market


Companies Profiled:

The report provides profiles of the companies in the market such as TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Amkor Technology, ASE Group., Broadcom Ltd, United Microelectronics Corporation, Intel Corporation., Samsung Electronics Co. Ltd, Pure Storage, Inc., Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics NV, and Jiangsu Changjiang Electronics Technology Co. Ltd.

 

Report Highlights:

The report provides deep insights into the demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of 3D IC and 2.5d IC packaging market. Moreover, the study highlights current market trends and provides forecast from 2018-2024. We also have highlighted future trends in the market that will affect the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players.


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