A recent report published by
Infinium Global Research on advanced packaging market provides in-depth
analysis of segments and sub-segments in the global as well as regional
advanced packaging market. The study also highlights the impact of drivers,
restraints, and macro indicators on the global and regional advanced packaging
market over the short term as well as long term. The report is a comprehensive
presentation of trends, forecasts, and dollar values of the global advanced packaging
market. According to the report, the global advanced packaging market is
projected to grow at a healthy CAGR over the forecast period of 2020-2026.
Advanced packaging has opened new
prototype in chip making and has changed semiconductor fabrication procedures.
Foundries have progressively benefitted from the automation of the advanced
packaging process, particularly underpinned by rising initiatives by electronic
design automation. Efforts are being made to make advanced packaging meet the
countless conditions of power dissipation, field operation, and most prominently
the cost. The development of the advanced packaging market also stems from the
necessity for high-performance chips for a variety of consumer electronics.
This has strengthened the demand for 3D and 2.5D packaging in chips that are
utilized in smartphones and numerous other mobile devices. In addition,
advances in panel-level fan-out technologies have also opened new opportunities
in the advanced packaging market.
The increasing need for high
performing chips in numerous consumer electronics devices is likely to assist
the advanced packaging market growth over the projection period. Additionally, the enormous demand for 3D Integrated Circuit and 2.5D packaging in chips that are
used in smartphones will raise the demand for advanced packaging during the
forecast years. In addition to this, large-scale adoption of next-gen
semiconductor tool is anticipated to scale up the use of innumerable advanced
packaging methods, thereby steering the industry trends. Moreover, the varying
customer trends for novel packaging technologies and continuous breakthroughs
made by major players for electronic items is likely to generate enormous
market demand over the forthcoming years. Also, the flourishing IoT sector is
projected to conclude into demand for semiconductor packaging. On the other
hand, the high cost of advanced packaging is restraining market growth.
Additionally, the current concern over the spread of coronavirus is also
expected to have a negative impact on the advanced packaging market. The global
COVID-19 outbreak has led to a sudden pause to manufacturing activities
worldwide, affecting the demand for advanced packaging. The most critically
impacted end-use segments of the advanced packaging industry include consumer
electronics, automotive, healthcare, and aerospace & defense. With the
outbreak of COVID-19, several countries enforcing strict lockdown policies,
production, and supply of critical raw materials used for the advanced
packaging market is extremely scarce in the global advanced packaging market.
Among the geographies, North
America region is expected to hold the largest share in the global advanced
packaging market. The industry is expected to offer huge opportunities for market growth on account of the presence of numerous semiconductor companies.
Furthermore, the Asia Pacific region is expected to witness high growth during
the forecast period. The expanding consumer electronics segment in the region
along with augmented government budget for the aerospace & defense sector in
China, Japan, India, and East Asian countries are anticipated to provide
positive opportunities for the market across the region.
The report on the global advanced
packaging market covers segments such as type and end use. On the basis of
type, the sub-markets include flip chip CSP, flip-chip ball grid array, wafer
level CSP, 2.5D/3D, fan out WLP, and others. On the basis of end use, the
sub-markets include consumer electronics, automotive, industrial, healthcare,
aerospace & defense, and others.
The report provides profiles of
the companies in the market such as Amkor Technology, Intel Corporation,
Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM,
Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog
Devices, and Samsung Electronics Co. Ltd.
The report provides deep insights
into the demand forecasts, market trends, and micro and macro indicators. In
addition, this report provides insights into the factors that are driving and
restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis
given in the report brings an insight into the investment areas that existing
or new market players can consider. The report provides insights into the
market using analytical tools such as Porter's five forces analysis and DRO
analysis of the advanced packaging market. Moreover, the study highlights current
market trends and provides forecast from 2020-2026. We also have highlighted
future trends in the market that will affect the demand during the forecast
period. Moreover, the competitive analysis given in each regional market brings
an insight into the market share of the leading players.