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Advanced Packaging Market (Type - Flip Chip CSP, Flip-chip Ball Grid Array, Wafer Level CSP, 2.5D/3D, Fan Out WLP, and Others; End Use - Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others): Global Industry Analysis, Trends, Size, Share and Forecasts to 2026

  • Published : June, 2020

  • Rep Id : CGP103

  • Category : Consumer Goods and Packaging

  • Status : Published

A recent report published by Infinium Global Research on advanced packaging market provides in-depth analysis of segments and sub-segments in the global as well as regional advanced packaging market. The study also highlights the impact of drivers, restraints, and macro indicators on the global and regional advanced packaging market over the short term as well as long term. The report is a comprehensive presentation of trends, forecasts, and dollar values of the global advanced packaging market. According to the report, the global advanced packaging market is projected to grow at a healthy CAGR over the forecast period of 2020-2026.

 

Market Insight

Advanced packaging has opened new prototype in chip making and has changed semiconductor fabrication procedures. Foundries have progressively benefitted from the automation of the advanced packaging process, particularly underpinned by rising initiatives by electronic design automation. Efforts are being made to make advanced packaging meet the countless conditions of power dissipation, field operation, and most prominently the cost. The development of the advanced packaging market also stems from the necessity for high-performance chips for a variety of consumer electronics. This has strengthened the demand for 3D and 2.5D packaging in chips that are utilized in smartphones and numerous other mobile devices. In addition, advances in panel-level fan-out technologies have also opened new opportunities in the advanced packaging market.

 

The increasing need for high performing chips in numerous consumer electronics devices is likely to assist the advanced packaging market growth over the projection period. Additionally, the enormous demand for 3D Integrated Circuit and 2.5D packaging in chips that are used in smartphones will raise the demand for advanced packaging during the forecast years. In addition to this, large-scale adoption of next-gen semiconductor tool is anticipated to scale up the use of innumerable advanced packaging methods, thereby steering the industry trends. Moreover, the varying customer trends for novel packaging technologies and continuous breakthroughs made by major players for electronic items is likely to generate enormous market demand over the forthcoming years. Also, the flourishing IoT sector is projected to conclude into demand for semiconductor packaging. On the other hand, the high cost of advanced packaging is restraining market growth. Additionally, the current concern over the spread of coronavirus is also expected to have a negative impact on the advanced packaging market. The global COVID-19 outbreak has led to a sudden pause to manufacturing activities worldwide, affecting the demand for advanced packaging. The most critically impacted end-use segments of the advanced packaging industry include consumer electronics, automotive, healthcare, and aerospace & defense. With the outbreak of COVID-19, several countries enforcing strict lockdown policies, production, and supply of critical raw materials used for the advanced packaging market is extremely scarce in the global advanced packaging market.

 

Among the geographies, North America region is expected to hold the largest share in the global advanced packaging market. The industry is expected to offer huge opportunities for market growth on account of the presence of numerous semiconductor companies. Furthermore, the Asia Pacific region is expected to witness high growth during the forecast period. The expanding consumer electronics segment in the region along with augmented government budget for the aerospace & defense sector in China, Japan, India, and East Asian countries are anticipated to provide positive opportunities for the market across the region.

 

Segment Covered

The report on the global advanced packaging market covers segments such as type and end use. On the basis of type, the sub-markets include flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan out WLP, and others. On the basis of end use, the sub-markets include consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others.

 

Companies Profiled:

The report provides profiles of the companies in the market such as Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog Devices, and Samsung Electronics Co. Ltd.

 

Report Highlights:

The report provides deep insights into the demand forecasts, market trends, and micro and macro indicators. In addition, this report provides insights into the factors that are driving and restraining the growth in this market. Moreover, The IGR-Growth Matrix analysis given in the report brings an insight into the investment areas that existing or new market players can consider. The report provides insights into the market using analytical tools such as Porter's five forces analysis and DRO analysis of the advanced packaging market. Moreover, the study highlights current market trends and provides forecast from 2020-2026. We also have highlighted future trends in the market that will affect the demand during the forecast period. Moreover, the competitive analysis given in each regional market brings an insight into the market share of the leading players.


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